SEMICONDUCTOR DEVICE WITH CO-PACKAGED DIE

Details for Australian Patent Application No. 2002337845 (hide)

Owner INTERNATIONAL RECTIFIER CORPORATION

Inventors STANDING, Martin

Pub. Number AU-A-2002337845

PCT Number PCT/US02/32677

PCT Pub. Number WO2003/063236

Priority 10/053,123 18.01.02 US

Filing date 9 October 2002

Wipo publication date 2 September 2003

International Classifications

H01L 023/10 Details of semiconductor or other solid state devices

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 029/74 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier

H05K 007/20 Constructional details common to different types of electric apparatus - Modifications to facilitate cooling, ventilating, or heating

H05K 005/06 Casings, cabinets or drawers for electric apparatus - Hermetically-sealed casings

H01L 023/02 Details of semiconductor or other solid state devices - Containers

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

Event Publications

20 February 2003 Complete Application Filed

  Priority application(s): 10/053,123 18.01.02 US

18 September 2003 Application Open to Public Inspection

  Published as AU-A-2002337845

7 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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