VENTED VIAS FOR VIA IN PAD TECHNOLOGY ASSEMBLY PROCESS YIELD IMPROVEMENTS

Details for Australian Patent Application No. 2002337798 (hide)

Owner INTEL CORPORATION

Inventors MCCORMICK, Carolyn; SATO, Daryl; BOGGS, David; JESSUP, Rebecca; DUNGAN, John

Pub. Number AU-A-2002337798

PCT Number PCT/US02/31332

PCT Pub. Number WO2003/028414

Priority 09/968,646 28.09.01 US

Filing date 30 September 2002

Wipo publication date 7 April 2003

International Classifications

H05K 001/11 Printed circuits - Printed elements for providing electric connections to or between printed circuits

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

20 February 2003 Complete Application Filed

  Priority application(s): 09/968,646 28.09.01 US

26 June 2003 Application Open to Public Inspection

  Published as AU-A-2002337798

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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