MULTILAYER CIRCUIT AND METHOD OF MANUFACTURING

Details for Australian Patent Application No. 2002337168 (hide)

International Classifications

Event Publications

20 February 2003 Complete Application Filed

Priority application(s): 20012052 23.10.01 FI

3 July 2003 Application Open to Public Inspection

Published as AU-A-2002337168

8 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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