METHOD OF FORMING SCRIBE LINE ON SEMICONDUCTOR WAFER, AND SCRIBE LINE FORMING DEVICE

Details for Australian Patent Application No. 2002336320 (hide)

Owner MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.

Inventors WAKAYAMA, Haruo

Pub. Number AU-A-2002336320

PCT Number PCT/JP02/11177

PCT Pub. Number WO2003/038880

Priority 2001-335149 31.10.01 JP

Filing date 28 October 2002

Wipo publication date 12 May 2003

International Classifications

H01L 021/301 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B28D 005/00 Fine working of gems, jewels, crystals, e.g. of semiconductor material

B23K 026/00 Working by laser beam, e.g. welding, cutting, boring

Event Publications

20 February 2003 Complete Application Filed

  Priority application(s): 2001-335149 31.10.01 JP

10 July 2003 Application Open to Public Inspection

  Published as AU-A-2002336320

15 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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