IMPROVED COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER

Details for Australian Patent Application No. 2002334686 (hide)

Event Publications

13 February 2003 Complete Application Filed

Priority application(s): 60/324,891 25.09.01 US

26 June 2003 Application Open to Public Inspection

Published as AU-A-2002334686

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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