LOW SIGNAL LOSS BONDING PLY FOR MULTILAYER CIRCUIT BOARDS

Details for Australian Patent Application No. 2002333668 (hide)

Owner TONOGA INC.

Inventors MCCARTHY, Thomas

Pub. Number AU-A-2002333668

PCT Number PCT/US02/29364

PCT Pub. Number WO2003/026371

Priority 09/952,486 14.09.01 US

Filing date 16 September 2002

Wipo publication date 1 April 2003

International Classifications

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 001/03 Printed circuits - Use of materials for the substrate

C08J 005/24 Manufacture of articles or shaped materials containing macromolecular substances - Impregnating materials with prepolymers which can be polymerised , e.g. manufacture of prepregs

Event Publications

13 February 2003 Complete Application Filed

  Priority application(s): 09/952,486 14.09.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002333668

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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