HEAT, MOISTURE, AND CHEMICAL RESISTANT POLYIMIDE COMPOSITIONS AND METHODS FOR MAKING AND USING THEM

Details for Australian Patent Application No. 2002332476 (hide)

Owner THE GOVERNMENT OF THE UNITED STATES OF AMERICA as represented by THE ADMINISTRATOR OF THE NATIONAL A

Inventors PATER, Ruth, H.

Pub. Number AU-A-2002332476

PCT Number PCT/US02/24996

PCT Pub. Number WO2003/085030

Priority 10/115,812 01.04.02 US

Filing date 8 August 2002

Wipo publication date 20 October 2003

International Classifications

C08G 069/28 Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule

B05D 005/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures

C08G 069/26 Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule

C08G 073/10 Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups

C08L 079/04 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups

C08L 079/08 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups

B32B 027/00 Layered products essentially comprising synthetic resin

Event Publications

13 February 2003 Complete Application Filed

  Priority application(s): 10/115,812 01.04.02 US

27 November 2003 Application Open to Public Inspection

  Published as AU-A-2002332476

16 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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