POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

Details for Australian Patent Application No. 2002332180 (hide)

Owner NISSAN CHEMICAL INDUSTRIES, LTD.

Inventors NAKAYAMA, Tomonari; KATO, Masakazu; NIHIRA, Takayasu

Pub. Number AU-A-2002332180

PCT Number PCT/JP02/09559

PCT Pub. Number WO2003/029899

Priority 2001-293269 26.09.01 JP

Filing date 18 September 2002

Wipo publication date 14 April 2003

International Classifications

G03F 007/037 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces

G03F 007/022 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Quinonediazides

C08L 079/08 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups

H01L 021/027 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

6 February 2003 Complete Application Filed

  Priority application(s): 2001-293269 26.09.01 JP

26 June 2003 Application Open to Public Inspection

  Published as AU-A-2002332180

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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