DIE ATTACH ADHESIVES FOR SEMICONDUCTOR APPLICATIONS, PROCESSES FOR PRODUCING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES PRODUCED BY SUCH PROCESSES

Details for Australian Patent Application No. 2002329808 (hide)

Owner DOW CORNING CORPORATION

Inventors WATSON, Michael, John

Pub. Number AU-A-2002329808

PCT Number PCT/US02/26787

PCT Pub. Number WO2003/025080

Priority 09/954,528 17.09.01 US

Filing date 23 August 2002

Wipo publication date 1 April 2003

International Classifications

C09J 011/04 Features of adhesives not provided for in group , e.g. additives

H01L 021/58 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/31 Details of semiconductor or other solid state devices

Event Publications

30 January 2003 Complete Application Filed

  Priority application(s): 09/954,528 17.09.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002329808

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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