METHOD FOR IMPROVING BONDING OF CIRCUIT SUBSTRATES TO METAL AND ARTICLES FORMED THEREBY

Details for Australian Patent Application No. 2002329794 (hide)

Owner WORLD PROPERTIES INC.

Inventors LANDI, Vincent, R.; NEILL, John, T.; MCALISTER, Bryan, C.

Pub. Number AU-A-2002329794

PCT Number PCT/US02/26566

PCT Pub. Number WO2003/020000

Priority 60/314,149 22.08.01 US

Filing date 21 August 2002

Wipo publication date 10 March 2003

International Classifications

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

30 January 2003 Complete Application Filed

  Priority application(s): 60/314,149 22.08.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002329794

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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