DIE BONDER AND METHOD FOR DETECTING MISALIGNED WORKPIECES

Details for Australian Patent Application No. 2002328008 (hide)

Owner CASEM (ASIA) PTE LTD

Inventors GOTSIS, Franz, Michael, Anastasius; RADECK, Stephanie, Elisabeth, Anna; TAN, Chin, Hiang

Pub. Number AU-A-2002328008

PCT Number PCT/SG02/00186

PCT Pub. Number WO2003/015158

Priority 200104676-2 06.08.01 SG

Filing date 5 August 2002

Wipo publication date 24 February 2003

International Classifications

H01L 021/68 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 013/08 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

F27D 021/04 Arrangement of monitoring devices

B65G 049/07 Conveying systems characterised by their application for specified purposes not otherwise provided for - for semiconductor wafers

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 200104676-2 06.08.01 SG

19 June 2003 Application Open to Public Inspection

  Published as AU-A-2002328008

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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