LAYERED CIRCUIT BOARDS AND METHODS OF PRODUCTION THEREOF

Details for Australian Patent Application No. 2002327548 (hide)

Owner HONEYWELL INTERNATIONAL INC.

Inventors OHR, Stephen

Pub. Number AU-A-2002327548

PCT Number PCT/US02/27299

PCT Pub. Number WO2003/020004

Priority 09/940,278 27.08.01 US

Filing date 26 August 2002

Wipo publication date 10 March 2003

International Classifications

H05K 003/10 Apparatus or processes for manufacturing printed circuits - in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

H05K 001/03 Printed circuits - Use of materials for the substrate

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 09/940,278 27.08.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002327548

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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