METHODS OF FORMING METALCOMPRISING MATERIALS AND CAPACITOR ELECTRODES; AND CAPACITOR CONSTRUCTIONS

Details for Australian Patent Application No. 2002327474 (hide)

Owner MICRON TECHNOLOGY, INC.

Inventors YANG, Haining

Pub. Number AU-A-2002327474

PCT Number PCT/US02/26191

PCT Pub. Number WO2003/017341

Priority 09/932,236 16.08.01 US

Filing date 15 August 2002

Wipo publication date 3 March 2003

International Classifications

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 09/932,236 16.08.01 US

29 May 2003 Application Open to Public Inspection

  Published as AU-A-2002327474

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002327475-SYSTEMS FOR AND METHODS OF PROVIDING PRIMARY, AUXILIARY OR BACKUP POWER TO ONE OR MORE LOADS

2002327473-SURFACE MOUNTABLE OPTOCOUPLER PACKAGE