Method of ablating an opening in a hard, non-metallic substrate

Details for Australian Patent Application No. 2002327193 (hide)

Owner Virtek Laser Systems, Inc

Inventors Archibald, Cec; Glover, Ruiz; Cummings, Mike

Agent Davies Collison Cave

Pub. Number AU-B-2002327193

PCT Number PCT/US02/21082

PCT Pub. Number WO2003/004210

Priority 60/302,495 02.07.01 US

Filing date 2 July 2002

Wipo publication date 21 January 2003

Acceptance publication date 9 August 2007

International Classifications

B28D 5/00 (2006.01) Fine working of gems, jewels, crystals, e.g. of semiconductor material

B23K 26/00 (2006.01) Working by laser beam, e.g. welding, cutting, boring

B23K 26/04 (2006.01) Working by laser beam, e.g. welding, cutting, boring - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

B23K 26/38 (2006.01) Working by laser beam, e.g. welding, cutting, boring

B28D 1/22 (2006.01) Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhere - by cutting, e.g. incising

C03B 33/08 (2006.01) Severing cooled glass

C03B 33/09 (2006.01) Severing cooled glass

C03C 23/00 (2006.01) Other surface treatment of glass not in the form of fibres or filaments

H05K 3/00 (2006.01) Apparatus or processes for manufacturing printed circuits

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 60/302,495 02.07.01 US

22 May 2003 Application Open to Public Inspection

  Published as AU-B-2002327193

9 August 2007 Application Accepted

  Published as AU-B-2002327193

6 December 2007 Standard Patent Sealed

28 January 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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