METHOD OF IMPROVING A SURFACE OF A SUBSTRATE FOR WAFER BONDING

Details for Australian Patent Application No. 2002326985 (hide)

Owner HRL LABORATORIES, LLC

Inventors SHI, Binqiang

Pub. Number AU-A-2002326985

PCT Number PCT/US02/29750

PCT Pub. Number WO2003/028075

Priority 60/325,276 26.09.01 US

Filing date 20 September 2002

Wipo publication date 7 April 2003

International Classifications

H01L 021/18 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 60/325,276 26.09.01 US

26 June 2003 Application Open to Public Inspection

  Published as AU-A-2002326985

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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