PLASMA CURING PROCESS FOR POROUS LOW-K MATERIALS

Details for Australian Patent Application No. 2002326676 (hide)

Owner AXCELIS TECHNOLOGIES, INC. DOW CORNING CORPORATION

Inventors ALBANO, Ralph; WALDFRIED, Carlo; SBROCKEY, Nick; HAN, Qinyuan; ESCORCIA, Orlando; DEMBOWSKI, Phil; BREMMER, Jeff; BERRY, III, Ivan, L.; BARGERON, Cory

Pub. Number AU-A-2002326676

PCT Number PCT/US02/26158

PCT Pub. Number WO2003/025993

Priority 09/952,649 14.09.01 US

Filing date 16 August 2002

Wipo publication date 1 April 2003

International Classifications

C01B 033/12 Silicon

C23C 016/56 Chemical deposition or plating by decomposition - After-treatment

H01L 021/3105 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/312 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/40 Chemical deposition or plating by decomposition - Oxides

H01L 021/316 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 09/952,649 14.09.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002326676

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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