COPPER FOIL WITH LOW PROFILE BOND ENHANCEMENT
Details for Australian Patent Application No. 2002324834 (hide)
International Classifications
Event Publications
16 January 2003 Complete Application Filed
Priority application(s): 09/948,166 06.09.01 US
19 June 2003 Application Open to Public Inspection
Published as AU-A-2002324834
10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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