POLISHING FLUID FOR METALLIC FILM AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING THE SAME

Details for Australian Patent Application No. 2002323920 (hide)

Owner ASAHI KASEI KABUSHIKI KAISHA

Inventors OKITA, Koshi; MIYAZAKI, Kuon; MATSUDA, Takayuki; TAKAHASHI, Hideaki

Pub. Number AU-A-2002323920

PCT Number PCT/JP02/08135

PCT Pub. Number WO2003/021651

Priority 2001-246898 16.08.01 JP; 2001-361030 27.11.01 JP

Filing date 8 August 2002

Wipo publication date 18 March 2003

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C09K 003/14 Materials not provided for elsewhere - Anti-slip materials

B24B 037/00 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped

Event Publications

16 January 2003 Complete Application Filed

  Priority application(s): 2001-246898 16.08.01 JP; 2001-361030 27.11.01 JP

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002323920

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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