STACKED CHIP ASSEMBLY WITH STIFFENING LAYER

Details for Australian Patent Application No. 2002323342 (hide)

Owner TESSERA, INC.

Inventors MOHAMMED, Ilyas

Pub. Number AU-A-2002323342

PCT Number PCT/US02/26805

PCT Pub. Number WO2003/019654

Priority 60/314,042 22.08.01 US

Filing date 22 August 2002

Wipo publication date 10 March 2003

International Classifications

H01L 023/14 Details of semiconductor or other solid state devices

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Event Publications

16 January 2003 Complete Application Filed

  Priority application(s): 60/314,042 22.08.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002323342

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002323343-SKIN TREATMENT METHOD AND APPARATUS

2002323341-FUEL TANKS