METHOD OF FORMING A BOND PAD AND STRUCTURE THEREOF

Details for Australian Patent Application No. 2002323303 (hide)

Owner MOTOROLA, INC.

Inventors POZDER, Scott, K.; KOBAYASHI, Thomas, S.

Pub. Number AU-A-2002323303

PCT Number PCT/US02/26607

PCT Pub. Number WO2003/025998

Priority 09/952,527 14.09.01 US

Filing date 20 August 2002

Wipo publication date 1 April 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

16 January 2003 Complete Application Filed

  Priority application(s): 09/952,527 14.09.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002323303

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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