CMP SYSTEM AND METHOD FOR EFFICIENTLY PROCESSING SEMICONDUCTOR WAFERS

Details for Australian Patent Application No. 2002322579 (hide)

Owner ORIOL, INC.

Inventors JEONG, In-Kwon

Pub. Number AU-A-2002322579

PCT Number PCT/US02/23276

PCT Pub. Number WO2003/011518

Priority 09/917,344 27.07.01 US

Filing date 23 July 2002

Wipo publication date 17 February 2003

International Classifications

B24B 007/00 Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces

B24B 009/00 Machines or devices designed for grinding edges or bevels on work or for removing burrs

B24B 051/00 Arrangements for automatic control of a series of individual steps in grinding a workpiece

B24B 001/00

Event Publications

16 January 2003 Complete Application Filed

  Priority application(s): 09/917,344 27.07.01 US

29 May 2003 Application Open to Public Inspection

  Published as AU-A-2002322579

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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