OPTICAL CHIP PACKAGING VIA THROUGH HOLE
Details for Australian Patent Application No. 2002320214 (hide)
International Classifications
Event Publications
16 January 2003 Complete Application Filed
Priority application(s): 09/896,189 29.06.01 US; 09/897,160 29.06.01 US; 09/896,983 29.06.01 US; 09/897,158 29.06.01 US; 09/896,665 29.06.01 US; 10/183,847 27.06.02 US; 60/302,578 29.06.01 US
15 May 2003 Application Open to Public Inspection
Published as AU-A-2002320214
18 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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