ARRANGEMENTS TO INCREASE STRUCTURAL RIGIDITY OF SEMICONDUCTOR PACKAGE

Details for Australian Patent Application No. 2002319797 (hide)

Owner INTEL CORPORATION

Inventors XIE, Hong; BANERJEE, Koushik; SATHE, Ajit; FRUTSCHY, Kristopher

Pub. Number AU-A-2002319797

PCT Number PCT/US02/25308

PCT Pub. Number WO2003/030256

Priority 09/964,494 28.09.01 US

Filing date 8 August 2002

Wipo publication date 14 April 2003

International Classifications

H01L 023/367 Details of semiconductor or other solid state devices

H01L 023/498 Details of semiconductor or other solid state devices

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

Event Publications

16 January 2003 Complete Application Filed

  Priority application(s): 09/964,494 28.09.01 US

26 June 2003 Application Open to Public Inspection

  Published as AU-A-2002319797

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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