DEVICE AND METHOD FOR SCRIBING FRAGILE MATERIAL SUBSTRATE

Details for Australian Patent Application No. 2002318751 (hide)

Owner MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.

Inventors WAKAYAMA, Haruo

Pub. Number AU-A-2002318751

PCT Number PCT/JP02/07326

PCT Pub. Number WO2003/008352

Priority 2001-218572 18.07.01 JP

Filing date 18 July 2002

Wipo publication date 3 March 2003

International Classifications

C03B 033/09 Severing cooled glass

H01L 021/78 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B23K 026/38 Working by laser beam, e.g. welding, cutting, boring

B23K 026/00 Working by laser beam, e.g. welding, cutting, boring

Event Publications

9 January 2003 Complete Application Filed

  Priority application(s): 2001-218572 18.07.01 JP

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002318751

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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