FILM FOR CIRCUIT BOARD

Details for Australian Patent Application No. 2002318730 (hide)

Owner AJINOMOTO CO., INC.

Inventors YOKOTA, Tadahiko; NAKAMURA, Shigeo

Pub. Number AU-A-2002318730

PCT Number PCT/JP02/07097

PCT Pub. Number WO2003/009655

Priority 2001-218279 18.07.01 JP

Filing date 12 July 2002

Wipo publication date 3 March 2003

International Classifications

H05K 001/03 Printed circuits - Use of materials for the substrate

B32B 015/08 Layered products essentially comprising metal - of synthetic resin

B32B 027/38 Layered products essentially comprising synthetic resin - comprising epoxy resins

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

Event Publications

9 January 2003 Complete Application Filed

  Priority application(s): 2001-218279 18.07.01 JP

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002318730

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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