CARRIER WITH METAL BUMPS FOR SEMICONDUCTOR DIE PACKAGES

Details for Australian Patent Application No. 2002318117 (hide)

Owner FAIRCHILD SEMICONDUCTOR CORPORATION

Inventors MADRID, Ruben

Pub. Number AU-A-2002318117

PCT Number PCT/US02/14171

PCT Pub. Number WO2002/093646

Priority 09/855,820 14.05.01 US

Filing date 2 May 2002

Wipo publication date 25 November 2002

International Classifications

H01L 023/495 Details of semiconductor or other solid state devices

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

H01L 029/40 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Electrodes

Event Publications

9 January 2003 Complete Application Filed

  Priority application(s): 09/855,820 14.05.01 US

1 May 2003 Application Open to Public Inspection

  Published as AU-A-2002318117

4 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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