PACKAGE FOR ELECTRONIC COMPONENTS AND METHOD FOR FORMING A PACKAGE FOR ELECTRONIC COMPONENTS

Details for Australian Patent Application No. 2002316957 (hide)

Owner MOTOROLA INC

Inventors HAUCK, Torsten; BOHM, Christina, Brigitte; KOLBECK, Anton; TRIGAS, Cynthia, Lee

Pub. Number AU-A-2002316957

PCT Number PCT/EP02/06071

PCT Pub. Number WO2003/021678

Priority 0121002.0 29.08.01 GB

Filing date 3 June 2002

Wipo publication date 18 March 2003

International Classifications

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 023/057 Details of semiconductor or other solid state devices

Event Publications

9 January 2003 Complete Application Filed

  Priority application(s): 0121002.0 29.08.01 GB

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002316957

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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