RESIN COMPOSITION

Details for Australian Patent Application No. 2002315804 (hide)

Owner KANEKA CORPORATION

Inventors TANAKA, Shigeru; MURAKAMI, Mutsuaki; SHIMO-OHSAKO, Kanji; ITOH, Takashi; NISHINAKA, Masaru

Pub. Number AU-A-2002315804

PCT Number PCT/JP02/06890

PCT Pub. Number WO2003/006553

Priority 2001-208606 09.07.01 JP; 2001-348287 14.11.01 JP; 2001-348303 14.11.01 JP

Filing date 8 July 2002

Wipo publication date 29 January 2003

International Classifications

C08L 079/08 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups

C09J 179/08 Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

Event Publications

2 January 2003 Complete Application Filed

  Priority application(s): 2001-208606 09.07.01 JP; 2001-348287 14.11.01 JP; 2001-348303 14.11.01 JP

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002315804

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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