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Details for Australian Patent Application No. 2002315086 (hide)

Owner CHIPPAC, INC.

Inventors LEE, Taekeun; CARSON, Flynn; KARNEZOS, Marcos

Pub. Number AU-A-2002315086

PCT Number PCT/US02/18645

PCT Pub. Number WO2003/021670

Priority 09/919,763 31.07.01 US

Filing date 12 June 2002

Wipo publication date 18 March 2003

International Classifications

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

H05K 007/20 Constructional details common to different types of electric apparatus - Modifications to facilitate cooling, ventilating, or heating

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 029/40 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Electrodes

H01L 021/82 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

2 January 2003 Complete Application Filed

  Priority application(s): 09/919,763 31.07.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002315086

6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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