METHOD FOR CHEMICAL MECHANICAL POLISHING (CMP) WITH ALTERING THE CONCENTRATION OF OXIDIZING AGENT IN SLURRY

Details for Australian Patent Application No. 2002312468 (hide)

Owner MOTOROLA, INC.

Inventors MAUTZ, Karl, Emerson; HAGGART, David, Weston, Jr.; MALTABES, John

Pub. Number AU-A-2002312468

PCT Number PCT/US02/18622

PCT Pub. Number WO2003/007360

Priority 09/901,365 09.07.01 US

Filing date 10 June 2002

Wipo publication date 29 January 2003

International Classifications

H01L 021/321 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

2 January 2003 Complete Application Filed

  Priority application(s): 09/901,365 09.07.01 US

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002312468

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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