ELECTROPLATING METHOD AND PRINTED WIRING BOARD MANUFACTURING METHOD

Details for Australian Patent Application No. 2002311292 (hide)

Owner RYOWA CO., LTD.

Inventors IWANAMI, Keiichi

Pub. Number AU-A-2002311292

PCT Number PCT/JP02/06622

PCT Pub. Number WO2003/002786

Priority 2001-198101 29.06.01 JP

Filing date 28 June 2002

Wipo publication date 3 March 2003

International Classifications

C25D 005/02 Electroplating characterised by the process - Electroplating of selected surface areas

C25D 007/00 Electroplating characterised by the article coated

H05K 003/24 Apparatus or processes for manufacturing printed circuits - Reinforcing of the conductive pattern

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 2001-198101 29.06.01 JP

15 May 2003 Application Open to Public Inspection

  Published as AU-A-2002311292

18 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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