POLYIMIDE ADHESION ENHANCEMENT TO POLYIMIDE FILM

Details for Australian Patent Application No. 2002309500 (hide)

Owner OAK-MITSUI, INC.

Inventors ZIMMERMAN, Scott, M.; SKORUPSKI, Edward, C.; SMITH, Gordon, C.

Pub. Number AU-A-2002309500

PCT Number PCT/US02/07430

PCT Pub. Number WO2002/093990

Priority 09/808,752 15.05.01 US

Filing date 11 March 2002

Wipo publication date 25 November 2002

International Classifications

H05K 003/00 Apparatus or processes for manufacturing printed circuits

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 09/808,752 15.05.01 US

1 May 2003 Application Open to Public Inspection

  Published as AU-A-2002309500

4 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002309501-MEMORY WITH A BIT LINE BLOCK AND/OR A WORD LINE BLOCK FOR PREVENTING REVERSE ENGINEERING

2002309499-APPARATUS AND METHOD PROVIDING A BALANCING LOAD TO A LASER DIFFERENTIAL DRIVE CIRCUIT