HEAT-CONDUCTIVE SILICONE COMPOSITION

Details for Australian Patent Application No. 2002308965 (hide)

Owner DOW CORNING TORAY SILICONE CO., LTD.

Inventors ONISHI, Masayuki; OKAWA, Tadashi; ONODERA, Satoshi; FUKUI, Hiroshi; SUTOH, Manabu; ENAMI, Hiroji

Pub. Number AU-A-2002308965

PCT Number PCT/JP02/04642

PCT Pub. Number WO2002/092693

Priority 2001-143109 14.05.01 JP; 2001-151356 21.05.01 JP; 2001-221952 23.07.01 JP

Filing date 14 May 2002

Wipo publication date 25 November 2002

International Classifications

C08L 083/04 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only

C08L 083/06 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only

C08K 003/22 Use of inorganic ingredients

C08K 009/06 Use of pretreated ingredients

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 2001-143109 14.05.01 JP; 2001-151356 21.05.01 JP; 2001-221952 23.07.01 JP

1 May 2003 Application Open to Public Inspection

  Published as AU-A-2002308965

4 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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