PROTECTION OF CONDUCTIVE CONNECTION BY ELECTROPHORESIS COATING AND STRUCTURE FORMED THEREOF

Details for Australian Patent Application No. 2002308489 (hide)

Owner HEWLETT-PACKARD COMPANY

Inventors PAN, Alfred, I-Tsung

Pub. Number AU-A-2002308489

PCT Number PCT/US02/13272

PCT Pub. Number WO2002/089543

Priority 09/844,377 27.04.01 US

Filing date 26 April 2002

Wipo publication date 11 November 2002

International Classifications

H05K 003/28 Apparatus or processes for manufacturing printed circuits - Applying non-metallic protective coatings

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B41J 002/16 Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - Production of nozzles

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 09/844,377 27.04.01 US

17 April 2003 Application Open to Public Inspection

  Published as AU-A-2002308489

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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