A METHOD OF WAFER/SUBSTRATE BONDING

Details for Australian Patent Application No. 2002307578 (hide)

Owner SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY

Inventors WEI, Jun; WANG, Zhiping; XIE, Hong

Pub. Number AU-A-2002307578

PCT Number PCT/SG02/00072

PCT Pub. Number WO2003/097552

Filing date 30 April 2002

Wipo publication date 2 December 2003

International Classifications

C03C 027/04 Joining glass to glass or to other materials

C04B 037/00 Joining burned ceramic articles with other burned ceramic articles or other articles by heating

H01L 021/98 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

19 December 2002 Complete Application Filed

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2002307578

20 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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