SUBSTRATE ADHESION ENHANCEMENT TO FILM

Details for Australian Patent Application No. 2002307319 (hide)

Owner OAK-MITSUI, INC.

Inventors SKORUPSKI, Edward, C.; GRAY, Jeffrey, T.; ANDRESAKIS, John, A.; HERRICK, Wendy

Pub. Number AU-A-2002307319

PCT Number PCT/US02/11801

PCT Pub. Number WO2002/089546

Priority 09/846,705 01.05.01 US

Filing date 11 April 2002

Wipo publication date 11 November 2002

International Classifications

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 09/846,705 01.05.01 US

17 April 2003 Application Open to Public Inspection

  Published as AU-A-2002307319

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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