METHOD FOR IMPROVED DIE RELEASE OF A SEMICONDUCTOR DEVICE FROM A WAFER

Details for Australian Patent Application No. 2002307119 (hide)

Event Publications

19 December 2002 Complete Application Filed

Priority application(s): 09/891,105 25.06.01 US

19 June 2003 Application Open to Public Inspection

Published as AU-A-2002307119

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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