MULTI-LAYER ELECTRODE ASSEMBLY INCLUDING A GELFORMING POLYMER AND AN ADHESIVE RESIN MATERIAL

Details for Australian Patent Application No. 2002306737 (hide)

Owner AMTEK RESEARCH INTERNATIONAL LLC

Inventors PEKALA, Richard, W.; KHAVARI, Mehrgan

Pub. Number AU-A-2002306737

PCT Number PCT/US02/08045

PCT Pub. Number WO2002/073714

Priority 60/275,963 14.03.01 US

Filing date 14 March 2002

Wipo publication date 24 September 2002

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 60/275,963 14.03.01 US

20 March 2003 Application Open to Public Inspection

  Published as AU-A-2002306737

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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