ENHANCED STRUCTURE AND METHOD FOR BURIED LOCAL INTERCONNECTS

Details for Australian Patent Application No. 2002306174 (hide)

Owner INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventors DIVAKARUNI, Ramachandra; GLUSCHENKOV, Oleg; MANDELMAN, Jack, A.; RADENS, Carl, J.; WONG, Robert, C.

Pub. Number AU-A-2002306174

PCT Number PCT/US02/19238

PCT Pub. Number WO2003/107430

Filing date 14 June 2002

Wipo publication date 31 December 2003

International Classifications

H01L 029/40 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Electrodes

H01L 021/82 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

19 December 2002 Complete Application Filed

26 February 2004 Application Open to Public Inspection

  Published as AU-A-2002306174

3 March 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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