A METHOD FOR APPLYING THICK COPPER ON SUBSTRATES

Details for Australian Patent Application No. 2002306013 (hide)

Owner TELEFONAKTIEBOLAGET LM ERICSSON (publ)

Inventors DRUGGE, Lars; FERM, Per

Pub. Number AU-A-2002306013

PCT Number PCT/SE02/01014

PCT Pub. Number WO2002/098193

Priority 0101868-8 28.05.01 SE

Filing date 27 May 2002

Wipo publication date 9 December 2002

International Classifications

H05K 003/10 Apparatus or processes for manufacturing printed circuits - in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

C25D 005/02 Electroplating characterised by the process - Electroplating of selected surface areas

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 0101868-8 28.05.01 SE

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2002306013

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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