LOW-TEMPERATURE PATTERNED WAFER BONDING WITH PHOTOSENSITIVE BENZOCYCLOBUTENE (BCB) AND 3D MEMS (MICROELECTROMECHANICAL SYSTEMS) STRUCTURE FABRICATION

Details for Australian Patent Application No. 2002305835 (hide)

Owner THE REGENTS OF THE UNIVERSITY OF MICHIGAN

Inventors BERNAL, Luis, P.; WASHABAUGH, Peter, D.; CHOU, Tsung-Kuan, A.; NAJAFI, Khalil

Pub. Number AU-A-2002305835

PCT Number PCT/US02/17781

PCT Pub. Number WO2002/100771

Priority 60/297,223 08.06.01 US

Filing date 5 June 2002

Wipo publication date 23 December 2002

International Classifications

B81C 001/00 Manufacture or treatment of devices or systems in or on a substrate

B81B 003/00 Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 60/297,223 08.06.01 US

15 May 2003 Application Open to Public Inspection

  Published as AU-A-2002305835

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002305836-COMBINATION OF A PTPase INHIBITOR AND A THIAZOLIDINEDIONE AGENT

2002305834-Compositions and methods for high-level, large-scale production of recombinant proteins