HIGH PERFORMANCE, LOW COST MICROELECTRONIC CIRCUIT PACKAGE WITH INTERPOSER

Details for Australian Patent Application No. 2002305191 (hide)

Owner INTEL CORPORATION

Inventors VANDENTOP, Gilroy; TANG, John; TOWLE, Steven

Pub. Number AU-A-2002305191

PCT Number PCT/US02/12088

PCT Pub. Number WO2002/089207

Priority 09/845,896 30.04.01 US

Filing date 19 April 2002

Wipo publication date 11 November 2002

International Classifications

H01L 023/498 Details of semiconductor or other solid state devices

Event Publications

19 December 2002 Complete Application Filed

  Priority application(s): 09/845,896 30.04.01 US

17 April 2003 Application Open to Public Inspection

  Published as AU-A-2002305191

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002305192-A THERMOPLASTIC RESIN COMPOSITION

2002305190-Molecular sequence of pig endogenous retrovirus receptors and methods of use