PRESSURE SENSITIVE ADHESIVE DOUBLE COATED TAPE AND METHOD FOR PRODUCING IC CHIP USING IT
Details for Australian Patent Application No. 2002304145 (hide)
International Classifications
Event Publications
12 December 2002 Complete Application Filed
Priority application(s): 2001-350863 15.11.01 JP; 2001-370757 04.12.01 JP; 2001-370759 04.12.01 JP; 2001-370774 04.12.01 JP; 2001-237082 03.08.01 JP; 2001-310543 05.10.01 JP
19 June 2003 Application Open to Public Inspection
Published as AU-A-2002304145
6 May 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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2002304146-ADHESIVE SUBSTANCE, ADHESIVE PRODUCT, AND CONNECTED STRUCTURE
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