METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2002304139 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors NAKAMURA, Genji; IMAI, Masayuki; YONEKAWA, Tsukasa; YOKOYAMA, Shin; NAKAJIMA, Anri; TADA, Yoshihide

Pub. Number AU-A-2002304139

PCT Number PCT/JP02/05386

PCT Pub. Number WO2002/099868

Priority 2001-168789 04.06.01 JP

Filing date 31 May 2002

Wipo publication date 16 December 2002

International Classifications

H01L 021/318 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/30 Chemical deposition or plating by decomposition - Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides

Event Publications

12 December 2002 Complete Application Filed

  Priority application(s): 2001-168789 04.06.01 JP

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2002304139

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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