Packaging for Containing and Dispensing Large Quantities of Wire
Details for Australian Patent Application No. 2002300767 (hide)
International Classifications
Event Publications
17 April 2003 Corrigenda
Complete Applications Filed - Name Index Under the name Lincoln Global, Inc., Application No. 2002300767, Under INID (54) correct the title to read Packaging for Containing and Dispensing Large Quantities of Wire.
12 June 2003 Application Open to Public Inspection
Published as AU-B-2002300767
14 August 2008 Application Accepted
Published as AU-B-2002300767
11 December 2008 Standard Patent Sealed
Legal
The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.
Next and Previous Patents/Applications
IP Reporting Samples
Customised IP Reporting
IP Insider for IP Professionals
IP Monitor Professional
- Editable Word format reports
- For IP Professionals
- Multiuser