LIGHTAND HEAT-CURING RESIN COMPOSITION

Details for Australian Patent Application No. 2002258215 (hide)

Owner TAIYO INK MANUFACTURING CO., LTD.

Inventors SAITO, Teruo

Pub. Number AU-A-2002258215

PCT Pub. Number WO2002/096969

Priority 2001-156328 25.05.01 JP

Filing date 22 May 2002

Wipo publication date 9 December 2002

International Classifications

C08G 059/14 Polycondensates containing more than one epoxy group per molecule

C08G 059/42 Polycondensates containing more than one epoxy group per molecule

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

G03F 007/032 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - with binders

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

Event Publications

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2002258215

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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