IC CHIP MOUNTING ELEMENT, PRODUCTION METHOD THEREFOR AND THERMAL TRANSFER FILM USED IN THE PRODUCTION METHOD

Details for Australian Patent Application No. 2002256897 (hide)

Owner OJI PAPER CO., LTD. NAIGAI CARBON INK CO., LTD.

Inventors MATSUMOTO, Shinsuke; HAYASHIDA, Toshio; TANAKA, Akihiro; SHIMONISHI, Toshiyuki; KOJO, Kiyoshi; FUJII, Hitoshi

Pub. Number AU-A-2002256897

PCT Pub. Number WO2002/095674

Priority 2001-219924 19.07.01 JP; 2001-151498 21.05.01 JP

Filing date 17 May 2002

Wipo publication date 3 December 2002

International Classifications

G06K 019/077 Record carriers for use with machines and with at least a part designed to carry digital markings - Constructional details, e.g. mounting of circuits in the carrier

B41J 002/325 Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - by selective transfer of ink from ink carrier, e.g. from ink ribbon or sheet

G06K 019/07 Record carriers for use with machines and with at least a part designed to carry digital markings - with integrated circuit chips

H01Q 001/36 Details of, or arrangements associated with, aerials - Structural form of radiating elements, e.g. cone, spiral, umbrella

B42D 015/10 Printed matter of special format or style not otherwise provided for - Identity, credit, cheque or like information-bearing cards

H01Q 001/38 Details of, or arrangements associated with, aerials - formed by a conductive layer on an insulating support

Event Publications

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2002256897

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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