SYSTEM ON A PACKAGE FABRICATED ON A SEMICONDUCTOR OR DIELECTRIC WAFER

Details for Australian Patent Application No. 2002256271 (hide)

Owner INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventors CHIU, George, Liang-Tai; MAGERLEIN, John, Harold

Pub. Number AU-A-2002256271

PCT Pub. Number WO2002/086971

Priority 09/838,725 19.04.01 US

Filing date 17 April 2002

Wipo publication date 5 November 2002

International Classifications

H01L 023/538 Details of semiconductor or other solid state devices

Event Publications

17 April 2003 Application Open to Public Inspection

  Published as AU-A-2002256271

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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