METHOD FOR GLOBAL DIE THINNING AND POLISHING OF FLIP-CHIP PACKAGED INTEGRATED CIRCUITS

Details for Australian Patent Application No. 2002255691 (hide)

Owner SCHLUMBERGER TECHNOLOGIES, INC.

Inventors TSAO, Chun-Cheng; VALLIANT, John

Pub. Number AU-A-2002255691

PCT Pub. Number WO2002/072311

Priority 60/275,670 13.03.01 US; 09/924,736 07.08.01 US

Filing date 11 March 2002

Wipo publication date 24 September 2002

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

B24B 007/22 Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces

B24B 001/00

B24B 049/12 Measuring - involving optical means

Event Publications

20 March 2003 Application Open to Public Inspection

  Published as AU-A-2002255691

12 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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