LAMINATE FOR ELECTRONIC MATERIAL

Details for Australian Patent Application No. 2002255266 (hide)

Owner NIPPON STEEL CHEMICAL CO., LTD.

Inventors OHTA, Takuhei; HIRAISHI, Katsufumi; TAKARABE, Taeko; TAKIYAMA, Syuji; KABEMURA, Eri; MIYAMOTO, Kazuya; MATSUDA, Takashi; SAWAMURA, Tazo

Pub. Number AU-A-2002255266

PCT Pub. Number WO2002/085616

Priority 2001-121553 19.04.01 JP

Filing date 19 April 2002

Wipo publication date 5 November 2002

International Classifications

B32B 015/08 Layered products essentially comprising metal - of synthetic resin

B32B 027/34 Layered products essentially comprising synthetic resin - comprising polyamides

C08G 073/10 Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups

H05K 001/03 Printed circuits - Use of materials for the substrate

Event Publications

17 April 2003 Application Open to Public Inspection

  Published as AU-A-2002255266

19 February 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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